＜USE＞

High precision Thickness Measurement for wafers like Si(silicon) and GaAs(gallium arsenide) for sem-iconductorsand metals.

＜FEATURES＞

１．Non-contact thickness measurement is possible with the laser method, and it does not cause damage such as scratches and contamination.
２．High precision non-contact thickness measurement possible.
３．Repeated thickness, warpage, parallelism, etc. can be measured.
４．Since the measurement is performed with the laser sensor heads placed opposite each other, the thickness can be measured accurately without being affected by the lift of the object being measured.

＜PERFORMANCE＞

　　Resolution　 　　　 　 0.01μｍ
　
　　Range of thickness measurement　　　 　Mａｘ．10ｍｍ
　　Power supply 　　　　　 　　　　　　　　　　　 AC100V　50/60Hz　3A

　　Weight： Approximately10ｋｇ


<SYSTEM BREAKDOWN>
Standard system consists of the following equipments:
① Thickness measuring equipment　1set
② Table (to be selected from several tables for your needs)　1set
③ Control box 　1set
④ Switch box 　 1set
⑤ Display unit (7" color LCD touch panel)　or laptop PC for measuring control 　1set
⑥ Connecting cables. 1set
⑦ Fine adjustment gauge (Select thickness) 　1 peace
⑧ Standard software for measuring control 　1set

and more options are available for your own use.

<Dimension Drawings>

(Remarks)

*1 It may not be possible to measure curvatures depending on the curvature level and stiffness.Please contact us for further information.

＜Customization Request＞

　Please contact us if you need other special specifications.　　　　　　　　　　　　　　

NON-CONTACT THICKNESS MEASURING DEVICE

　＜Send your inquiries to＞

　Sasaki-koki, Co, INC. 　　

TOP

SASAKI KOKI Inc.
1-9-33 Shinomoge, Takatsu-ku, Kwasaki City, Kanagawa Pref. Zip-Code 213-0006 Japan

TEL +81-44-844-0338 　FAX +81-44-822-0922
E-MAIL to here　U.R.L. http://www.sasaki-koki.co.jp
Part processing （Machining center、CNC Lathe、CNC Fraise、Discharge Machine、Welding, etc.）　Automation machines, Laborsaving machines, Manufacturing with flexible designing.

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