NON-CONTACT THICKNESS MEASURING DEVICE

OZUMA CL

(For Wafers Thickness Measurement )

＜USE＞

High precision Thickness Measurement for wafers like Si(silicon) and GaAs(gallium arsenide) for sem-iconductorsand metals.

＜FEATURES＞

１．Non-contact thickness measurement is possible with the laser method, and it does not cause damage such as scratches and contamination.
２．High precision non-contact thickness measurement possible.
３．Repeated thickness, warpage, parallelism, etc. can be measured.
４．Since the measurement is performed with the laser sensor heads placed opposite each other, the thickness can be measured accurately without being affected by the lift of the object being measured.

＜PERFORMANCE＞

　　Resolution　 　　　 　 0.01μｍ
　
　　Range of thickness measurement　　　 　Mａｘ．10ｍｍ
　　Power supply 　　　　　 　　　　　　　　　　　 AC100V　50/60Hz　3A

　　Weight： Approximately10ｋｇ
　　　　　　　　　　　


<SYSTEM BREAKDOWN>
Standard system consists of the following equipments:

and more options are available for your own use.

<Dimension Drawings>

(Remarks)

＜Customization Request＞

　　Please contact us if you need other special specifications.　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　

NON-CONTACT THICKNESS MEASURING DEVICE

　＜Send your inquiries to＞

　Sasaki-koki, Co, INC. 　　

TOP

1-9-33 Shinomoge, Takatsu-ku, Kwasaki City, Kanagawa Pref. Zip-Code 213-0006 Japan